The ULVAC Group received three awards at the 2025 Awards presented by the Japan Vacuum Industry Association (JVIA), including the Grand Prize for Vacuum Equipment, a Vacuum Equipment Award, and a Skills and Operations Award.
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ULVAC, Inc. anticipates that orders for its continuous vacuum melting furnaces dedicated to rare-earth magnets will approximately triple year on year, driven primarily by magnet manufacturers in Europe and North America.
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ULVAC, Inc. has been participating since 2022 in the Chiplet Integration Platform Consortium at Institute of Science Tokyo.
Through this consortium, ULVAC will present its low-warpage multilayer RDL technology using dry film and fine via etching processes at the 2026 IEEE 76th Electronic Components and Technology Conference (ECTC 2026), the world's largest conference on semiconductor packaging.
Union City, California―April 20, 2026―ULVAC, Inc. announced that US‑JOINT, a consortium comprising 12 Japanese and U.S. materials and equipment companies, has commenced full‑scale operations with the aim of establishing a new technology development model in the field of next‑generation semiconductor packaging.
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